Wafer-scale mass production
- For batch fabrication of micro-bumps in semiconductor chip packaging and wafer-level packaging. Wafer-scale batch fabrication of micro-bumps can greatly shorten the mass production cycle of high-end chip packaging.
High Efficiency & Flexibility
- Micro-bump fabrication efficiency reaches up to 5,000 per second,suitable for producing micro-bumps of various materials and sizes.
Precise Control
- Dimensional deviation of the micro-bump array printing is controlled within ±3%,and deposition position deviation is within ±2.0μm.
Intelligent Control
- Automatically identifies and aligns with wafer/chip pads, enabling fully automated splicing printing of wafer-level micro-bump arrays.
Eco-friendly & Safe
- No flux application, no reflow soldering or cleaning processes, and no flux materials or vapors after micro-bump printing – safe and environmentally friendly.
User-friendly Operation
- Fully automated processing for laser micro-bump printing and inspection, with a simple and intuitive human-machine interface.